Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry

Product Details
Customization: Available
After-sales Service: Vieo or on Site
Warranty: 1 Year
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  • Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
  • Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
  • Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
  • Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
  • Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
  • Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
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  • Overview
  • Product Description
  • Product Parameters
  • Our Advantages
  • Packaging & Shipping
  • After Sales Service
  • Company Profile
  • FAQ
Overview

Basic Info.

Model NO.
SGC 45
Process Usage
Silicon Cropping and Squaring
Movement Method
Linear Control
Control Method
Closed-Loop Control
Numerical Control
PLC
Processing Precision
+- 0.03 mm
Performance Classification
Economical CNC Machine Tools
Certification
CE
Condition
New
Key Words
Silicon Diamond Wire Saw
Customized
Can Be Customized
Color
on Request
Product Name
Silicon Single Diamond Wire Saw
After-Sales Service Provided
24 Hours Online Service
Machine Weight
2000 Kg
Cutting Material
Silicon Ingot
Cutting Method
Wet Cut
Cutting Tool
Endless Diamond Wire Loop
Function
Cut off, Seeding, Straight Cut
Automatic Cut
Yes
Axis
Y Axis ,Z Axis
Water Recycle System
Yes
Electric
220V, 240V, 380V,110V
Cut Material Size
8 Inch, 12 Inch, 18 Inch
Transport Package
Wood Creat
Trademark
SHINE
Origin
China
HS Code
8461500090
Production Capacity
100-200 Sets

Product Description

High-Speed Endless Diamond Wire Saw for Silicon

Product Description

The High-Speed Endless Diamond Wire Saw for Silicon is designed for precise and efficient cutting of silicon ingots. It features an endless diamond wire that ensures smooth and accurate cuts, reducing material waste and improving productivity.

This device is a diamond cutting equipment specifically designed for the semiconductor and photovoltaic industries to do Silicon Ingot Cutting . The cutting tool used is the latest closed-loop diamond wire, capable of segmenting the silicon rod and taking slices/seeds after the cutting process.

SGC45 is designed for the cutting of 18-inch silicon rods, while a similar structure, SGC30, is suitable for cutting 12-inch silicon rods.

Compared to diamond band saws and traditional single-wire cutting devices, this circular or endless diamond wire cutting equipment exhibits a lower edge chipping rate, superior cutting surface quality, and reduced material wastage.

Product Features

- High-speed cutting up to 80 m/s
- Endless diamond wire design for smooth cutting
- Suitable for silicon ingots
- Precision cutting with minimal material loss
- Durable construction for long-term use

Product Appliction 
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
Top &Tail Cut

Specifically designed to handle 18-inch diameter silicon ingots, this machine excels in the precise removal of head and tail sections of the rods.
 
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
Brigde Cutting/Cropping

This machine have 400 feed which can section the silicon rod automatically.
 
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
Seeding 

One of the key applications of this machine is its ability to perform seeding on segmented silicon rods



 

Product Parameters


SGC45 Silicon Ingot Cutting Machine
  Parameter Value or Specification
1 Maximum Workpiece Diameter (mm) 450
2 Maximum Workpiece Length (mm) 1500
3 Worktable Y-Axis Travel (mm) 400
4 Worktable Z-Axis Travel (mm) 500
5 Maximum Diamond Wire Speed (m/s) 36 (Max)
6 Minimum Feed Increment X-Axis (mm) 0.01
7 Minimum Feed Increment Y-Axis (mm) 0.01
8 Repeat Positioning Accuracy X-Axis (mm) ±0.02
9 Repeat Positioning Accuracy Y-Axis (mm) ±0.02
10 Total Power Consumption (kW) 3.5
11 Power Supply (Three-phase Five-wire) AC220V 50Hz
12 Air Supply (MPa) 0.6
13 Machine Size(mm) 2000*1200*1800
14 Machine weight(kg) 1800

 


Application Fields:

- Semiconductor industry
- Solar Ingot manufacturing
- Optoelectronics
 

Our Advantages

Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
Specialization for Large Ingots

Specifically designed to handle 18-inch diameter, 1.5-meter-long monocrystalline silicon rods, making it ideal for processing large ingots which are common in the industry.
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
Precision Cropping and Seeding

Offers high-precision removal of head and tail sections and accurate segmentation of the ingot, which is crucial for high-quality wafer production
 
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
Endless Diamond Wire Technology

The use of a continuous diamond wire ensures efficient, consistent cuts with a significantly reduced risk of wire breakage compared to traditional methods
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
Less Edge Break and Better Cutting Surface

The diamond wire saw provides a superior cutting surface, resulting in fewer edge breaks and contributing to the overall quality of the wafers.
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
User-Friendly Interface

eatures an intuitive control panel for easy operation, allowing for quick setup and adjustments with minimal training.


Instructions for Use


1. Ensure the machine is properly installed and connected to the power supply.
2. Load the silicon material onto the cutting table.
3. Set the desired cutting speed and parameters using the control panel.
4. Start the machine and monitor the cutting process.
 

Packaging & Shipping

Packaging
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry

The diamond wire saw will be put into a wood crate.


Lead Time

Normally we will send machine out 30 working days after order confirmation, some time can be within 15 days.

International Shipping Methods

We offer flexible international shipping options to accommodate the diverse needs of our clients. Our shipping terms include FOB (Free on Board), CNF (Cost and Freight), and door-to-door delivery. The majority of our shipments are transported via sea freight, ensuring cost-effective and reliable delivery for bulk orders. Additionally, we have extensive experience with air freight for time-sensitive shipments, providing faster delivery while maintaining the integrity of the products.

Shipping Options:

  • FOB (Free on Board): We handle the costs and risks up to the port of shipment. The buyer takes responsibility from the port of origin, ensuring control over the logistics and costs beyond that point.
  • CNF (Cost and Freight): We cover the cost of shipping the goods to the port of destination. The buyer assumes responsibility for insurance and other costs once the goods are in transit.
  • Door-to-Door Delivery: We manage the entire logistics process from our facility directly to your specified location, offering a hassle-free and convenient shipping solution.

Our team is committed to providing timely and efficient delivery, tailored to meet your specific requirements, ensuring that your orders arrive safely and on schedule. Whether by sea or air, we prioritize the safe handling and transport of our products to maintain their quality and performance.



 

After Sales Service



Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry

 

Company Profile



Shine Smart Equipment is a leading manufacturer of cutting-edge diamond wire saws, specializing in high-precision cutting solutions for the semiconductor and solar industries. With a commitment to innovation and quality, we provide our customers with reliable and efficient diamond wire cut equipment that meets their production needs.
Shine Smart Company History 
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry

In August 2016, we established our company with a registered capital of 10 million RMB in Shanghai,covering an area of 3,000 square meters, starting the production of complete machine series, such as reciprocating diamond wire cutting machines, grinding machines, and polishing machines.
in 2018, we embarked on an intensive research journey into endless diamond wire cutting technology. Through unwavering dedication and rigorous research, we committed ourselves to achieving excellence in this field.
By 2020, we had taken a significant stride forward. A series of circular diamond wire cutting machines, validated by the market, underwent continuous updates and iterations, reaching new heights. This momentous achievement marked our company's ascent to a prominent position in the industry.
Then came 2022, a year that will forever be etched in our history. Our cutting equipment witnessed a substantial breakthrough, leading to a massive surge in applications across industries, including graphite cutting, silicon rod slicing, and optical crystal cutting. This turning point not only affirmed the wide-ranging applicability of our technology but also underscored our leading role within the industry.
Over the past few years, we haven't merely witnessed technological advancement; we've actively shaped the future of technology. Our passionate team remains dedicated to driving innovation and delivering exceptional solutions to our clients. Looking ahead, we are committed to maintaining our industry leadership, continually solidifying our position through outstanding products and services, and opening up broader horizons for our valued customers..
 
Commitment to quality
Smart Single Diamond Wire Saw for Advanced Silicon Ingot Cropping and Cutting in Semiconductor Industry
We have full confidence in the stability of equipment quality, stemming from our mature and rigorous management processes. From the procurement of raw materials to production organization and the final product delivery, each step is governed by well-established procedures, process specifications, and inspection criteria.Every CNC machine is assigned a unique ID number and undergoes over 200 electrical tests, more than 30 mechanical precision tests, and over 20 final inspections before leaving the factory. This multilayered, strict oversight ensures the conformity and traceability of product components at every stage.
 
 

Research, Development And Innovation
At the forefront of diamond wire cutting technology, we continuously drive innovation in the development of our circular diamond wire cutting equipment. We have pioneered a groundbreaking design that seamlessly integrates slicing, outer contouring, and inner contouring into a single device. 
This innovation represents our unwavering commitment to delivering exceptional performance and multifunctionality, meeting our customers' demands for efficient and precise cutting solutions. 
Our R&D team consistently pushes the boundaries of technology, offering unprecedented innovations that keep our clients at the forefront of their industries.

Company Culture And Values
At the core of our company, our culture and values reflect our fundamental beliefs. We are a trustworthy and responsible enterprise, driven by an unwavering commitment to excellence in all we do.
Environmental sustainability is a driving force for us. Recognizing the finite nature of our planet's resources, we are dedicated to minimizing our environmental footprint and embracing sustainable practices, ensuring that our products deliver high performance while preserving the Earth.
Solving customer problems is our raison d'être. We concentrate on delivering value-added equipment, actively listening to our customers' needs, and providing innovative solutions. We believe that by helping our customers succeed, we, too, achieve success.
We also deeply care about the physical and mental well-being of our employees. We are committed to creating a happy work-life balance for our team, as we believe that only content and fulfilled employees can create outstanding products and services.
These principles form the bedrock of our enterprise, and we will continue to progress under these values, relentlessly pursuing excellence while serving the environment, our customers, and our employees for collective success and enduring sustainability.
 

FAQ


Q1: What is the warranty period for this machine?
A1: We offer a one-year warranty on all parts.

Q2: Can this machine cut other materials besides silicon?
A2: Yes, it can also cut materials like graphite, optical glass, and ceramics with the appropriate adjustments.

Q3: What is the delivery time for this machine?
A3: The standard delivery time is 30 days from the date of order confirmation.sometime can be faster. 



 Videos
Contact us to check bellow videos 
- Video 1: Equipment operation demonstration
- Video 2: Customer case study
 
 
Please contact us to check out the machine models you need!
 
 
 
 

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