Igh-Precision Diamond Wire Saw for Photovoltaic Silicon Rod Slicing

• Customization: Available
• Application: Silicon
• Type: Electroplating
• Model NO.: 0.028 mm
• Core Wire: Tungsten Wire
• Core Wire Dia: 35 Um
• Cut Material: Silliconoptical Glass, Gemstone, Sapphire, Quartz,
• Customized: Wire Length Can Be Customized
• Diamond Grit: 6-12 Um
• Girt Quantity: 120-220 PC/mm
• Breaking Force(N): More Than 6.1
• Twsit Numbers: More Than 25
• Free Shrinkage Rate(mm): Less Than 30
• Appreance: Smooth
• Transport Package: Carton Box
• Specification: 0.028 mm
• Trademark: Shine
• Origin: China
• HS Code: 82079010
• Production Capacity: 1000000 Kms

Product Description

  Diamond Wire Saw

Product Description

Product Overview

diamond wire saw used for cutting silicon is a specialized tool designed for slicing silicon materials. This type of wire saw is widely utilized in the photovoltaic and semiconductor industries, particularly for cutting monocrystalline and polycrystalline silicon ingots.

The diamond wire saw consists of a steel wire coated with diamond particles, which cuts through silicon via high-speed reciprocating or rotating motion. Its main advantages include:

1. Efficiency: High cutting speed, enhancing production efficiency.
2. Precision: Accurate cutting process, resulting in thin and flat silicon wafers.
3. Minimal Material Waste: The very thin cutting wire minimizes material waste.
4. Clean Cutting: Produces less debris, reducing the amount of post-cutting cleaning required.

Structure and Materials

1. Core Wire : Typically made from high-strength steel wire or Tungsten wire, providing necessary strength and flexibility.
2. Diamond Particles: Diamond particles are bonded to the surface of the steel wire using electroplating or resin bonding methods. The size and concentration of the diamond particles vary according to different cutting requirements.
3. Coating Technology: Electroplating technology is often used to evenly coat diamond particles on the steel wire, ensuring uniformity and stability during cutting.

Features and Specifications

1. Wire Diameter: Common wire diameters range from 0.1 mm to 0.3 mm, depending on the required cutting precision.
2. Diamond Particle Size: The size of the particles generally ranges from a few microns to tens of microns. Smaller particles provide smoother cutting surfaces but may cut slower.
3. Strength and Durability: High-quality steel wire and diamond coating ensure the cutting wire maintains its integrity under high-stress conditions.

Advantages

1. High Precision: Due to the hardness of diamonds, the cutting wire can achieve very high precision, resulting in smooth cutting surfaces.
2. Low Material Waste: The thin diameter of the cutting wire minimizes material waste, making it more efficient than traditional blade cutting.
3. High Efficiency: Fast cutting speed makes it suitable for large-scale production, increasing production efficiency.

Applications

1. Photovoltaic Industry:

   • Solar Panel Manufacturing: Cutting monocrystalline and polycrystalline silicon wafers used in solar cells.
   • Solar Wafer Production: Precision slicing of large silicon ingots into thin wafers for efficient solar energy conversion.

2. Semiconductor Industry:

   • Integrated Circuit Fabrication: Cutting silicon wafers that serve as the base for integrated circuits in computers, smartphones, and other electronic devices.
   • Microelectromechanical Systems (MEMS): Slicing silicon for MEMS components used in sensors, actuators, and microelectronics.

3. LED Manufacturing:

   • LED Chip Production: Cutting silicon substrates for LED chips used in various lighting applications, including displays, automotive lighting, and general illumination.
   • Optoelectronic Devices: Precision cutting for silicon-based optoelectronic components used in fiber optics and communication devices.

4. Medical Devices:

   • Microfluidic Devices: Cutting silicon wafers for lab-on-a-chip technologies used in medical diagnostics and drug delivery systems.
   • Silicon-based Sensors: Manufacturing biosensors and other silicon-based medical diagnostic tools.

5. Consumer Electronics:

   • Smartphone Components: Cutting silicon wafers for various smartphone components, including processors and sensors.
   • Wearable Technology: Precision slicing of silicon for components used in wearable devices like smartwatches and fitness trackers.

6. Aerospace and Defense:

   • High-Performance Sensors: Manufacturing silicon-based sensors for aerospace applications, including navigation systems and environmental monitoring.
   • Microelectronics for Defense: Cutting silicon for microelectronic components used in advanced defense systems.

7. Automotive Industry:

   • Advanced Driver Assistance Systems (ADAS): Cutting silicon for sensors and processors used in ADAS technologies.
   • Electric Vehicle (EV) Components: Manufacturing silicon wafers for power electronics and control systems in electric vehicles.

8. Industrial Automation:

   • Robotic Systems: Cutting silicon for sensors and control systems used in industrial robotics and automation technologies.
   • Industrial IoT Devices: Manufacturing silicon-based components for industrial Internet of Things (IoT) applications.

9. Research and Development:

   • Material Science: Precision cutting of silicon samples for research in material science and nanotechnology.
   • Prototype Development: Slicing silicon wafers for prototyping and development of new semiconductor technologies.

10. Energy Storage:

• Battery Technology: Cutting silicon wafers for use in next-generation lithium-ion batteries and other advanced energy storage syste

Product Classification

Classification by Manufacturing Process

1. Electroplated Diamond Wire:

   • Single-layer Electroplated: Diamond particles are fixed to the surface of the steel wire through electroplating, mainly used for cutting silicon, sapphire, etc.
   • Multi-layer Electroplated: Uses a multi-layer electroplating process, ensuring more uniform distribution of diamond particles and higher durability, suitable for high-intensity cutting applications.

2. Resin Bond Diamond Wire:

   • Resin Coated: Uses resin to bond diamond particles to the steel wire, typically used for applications requiring high cutting smoothness.

Classification by Application Fields

1. Photovoltaic Industry Diamond Wire:

   • Specifically used for cutting monocrystalline and polycrystalline silicon to manufacture solar panels.

2. Semiconductor Industry Diamond Wire:

   • Used for cutting semiconductor wafers to produce integrated circuits and other electronic components.

3. LED Industry Diamond Wire:

   • Used for cutting LED substrates to produce LED chips.

4. Hard and Brittle Materials Processing Diamond Wire:

   • Suitable for cutting sapphire, glass, ceramics, and other hard and brittle materials.

Classification by Wire Diameter

1. Ultra-fine Diamond Wire:

   • Diameter usually below 0.1 mm, suitable for ultra-precise and ultra-thin material cutting.

2. Standard Diamond Wire:

   • Diameter between 0.1 mm and 0.3 mm, suitable for most conventional cutting applications.

3. Thick Diamond Wire:

   • Diameter over 0.3 mm, suitable for cutting applications requiring higher strength and durability.

 

Product Parameters

Diamond Wire On Spool

1. Diamond  Wire For Wafering

Diamond cutting wire for wafering is mainly used for cutting photovoltaic and semiconductor materials. The advantages of diamond cutting wire are:

1. High cutting efficiency and environmentally friendly
2. Reduce silicon wafer loss and lower costs
3. Reduce TTV and other cutting defects and improve cutting quality

 

Diamond Wire For Wafering Parameter
Core Wire	Outer Diameter (Wire Diameter Range mm)	Common Name	Application Areas (Cutting Products)	Features
Carbon steel	0.025-0.032	Ultra-fine Diamond Wire	Silicon Wafering	Even distribution of surface particle numbers: Extremely obvious cost, efficiency, and environmental advantages. The advantages of rolling are reflected in the field of photovoltaic silicon wafer manufacturing
Tungsten wire	0.028-0.080

 

2. Diamond  Wire For Cropping and Squaring 

Diamond wire for cropping ans squaring is mainly used for cutting high hardness materials such as photovoltaic cutting, sapphire, magnetic materials, etc. 


 

Diamond Wire For Cropping Parameter
Core Wire	Outer Diameter (Wire Diameter Range mm)	Common Name	Application Areas (Cutting Products)	Features
Carbon steel	0.07-0.10	Standard Diamond Wire:	Wafer semiconductor	Uniform surface particle distribution, good cutting surface quality, low damage layer
Carbon steel	0.10-0.25		Magnetic materials	Stable process, good cutting surface quality, not easy to damage the product
Carbon steel	0.14-0.16		Glass	High cutting rate
Carbon steel	0.16-0.22		Silicon carbide semiconductor, ceramics	High cutting rate
Carbon steel	0.2-0.25		Sapphire	Uniform surface particle distribution, good cutting surface quality, high cutting rate
Carbon steel	0.30-0.40	Thick Diamond Wire	Silicon Squaring	Low wire consumption
Carbon steel	0.33-0.37		Silicon Core Cut	Strong cutting force, wear-resistant, low wire consumption
Carbon steel	0.37-0.45		Silicon Cropping	Strong cutting force, wear-resistant, low wire consumption
Carbon steel	0.45-0.65		Stone Cut	Suitable for cutting large-size stones
Carbon steel	0.4-0.45		Gemstone Cut	Strong cutting force, wear-resistant, low wire consumption

WireOuter Diameter
There is another Diamond Wire used for Silicon Cropping ans Squaring is called Diamond Wire Loop or Endless Diamond Wire.
Check bellow image if you have interest in this new diamond wire 

 

Packaging & Shipping

Product Packaging Description

Our diamond wire is meticulously packaged to ensure maximum protection and maintain its pristine condition during transportation. The packaging process includes the following steps:

1. Spooling: The diamond wire is carefully wound onto a spool to prevent tangling and ensure ease of handling.
2. Vacuum Sealing: The spooled wire is then placed in a vacuum-sealed bag. This step helps protect the wire from moisture, dust, and other environmental contaminants, preserving its quality.
3. Boxing: The vacuum-sealed spool is securely placed in a sturdy paper box. The box provides an additional layer of protection against physical damage during handling and shipping.
4. Reinforced Crating: For long-distance transportation, we reinforce the packaging by placing the boxed spool into a wooden crate. The crate ensures the diamond wire remains stable and secure, providing robust protection against potential impacts and vibrations.

This comprehensive packaging approach guarantees that our diamond wire arrives at its destination in perfect condition, ready for immediate use.

Shinpping

 The diamond wire loops will be send to client's location in 7 days after order confirmation by DHL or Fedex.

FAQ

FAQ:

• Q1: What materials can be cut using diamond cutting wire?
  A1: Diamond cutting wire is highly versatile and can be used to cut a variety of hard and brittle materials, including silicon (monocrystalline and polycrystalline), sapphire, glass, ceramics, and certain metals.

  Q2: How do I choose the appropriate diamond wire for my application?
  A2: Choosing the appropriate diamond wire depends on several factors, including the material to be cut, the required cutting precision, the desired cutting speed, and the thickness of the material. Our team can assist in selecting the right wire based on your specific needs.

  Q3: What are the advantages of using diamond cutting wire over traditional cutting methods?
  A3: Diamond cutting wire offers several advantages, such as higher precision, reduced material waste, smoother cut surfaces, faster cutting speeds, and lower operational costs due to its efficiency and durability.

  Q4: How should diamond cutting wire be stored?
  A4: Diamond cutting wire should be stored in a cool, dry place, away from direct sunlight and moisture. It is also advisable to keep the wire in its original packaging until it is ready for use to prevent contamination and damage.

  Q5: What is the expected lifespan of a diamond cutting wire?
  A5: The lifespan of diamond cutting wire varies depending on the cutting conditions, such as the material being cut, the cutting speed, and the wire tension. Regular inspection and proper maintenance can help extend the wire's lifespan.

  Q6: How do I maintain and clean diamond cutting wire?
  A6: Maintenance involves regular inspection for wear and tear, ensuring proper tension during use, and using appropriate lubricants and cooling fluids to reduce friction and heat buildup. Cleaning should be done with care to avoid damaging the diamond coating.

  Q7: Can diamond cutting wire be used with any cutting machine?
  A7: Diamond cutting wire is compatible with various wire saw machines, but it is important to ensure that the machine is designed to accommodate diamond wire and has the necessary tensioning and cooling systems for optimal performance.

  Q8: What are the typical applications of diamond cutting wire in the photovoltaic industry?
  A8: In the photovoltaic industry, diamond cutting wire is primarily used for slicing monocrystalline and polycrystalline silicon wafers, which are essential components in the manufacture of solar cells and panels.

  Q9: How do you ensure the quality of diamond cutting wire?
  A9: We ensure the quality of our diamond cutting wire through stringent quality control measures, including using high-grade raw materials, employing advanced manufacturing techniques, and conducting thorough testing to meet industry standards.

  Q10: What should I do if the diamond cutting wire breaks during use?
  A10: If the wire breaks, stop the machine immediately to prevent further damage. Inspect the wire and the machine to identify the cause of the breakage, such as improper tension, excessive wear, or machine malfunction. Replace the broken wire with a new one and ensure proper setup before resuming operations.

   

Application Case

Case 1: Semiconductor Industry

Challenge: The client required a solution for slicing large silicon ingots into wafers for integrated circuits, with high precision and minimal surface damage.
Solution: Utilization of multi-layer electroplated diamond cutting wire.
Outcome: The advanced diamond cutting wire provided precise and clean cuts, reducing the occurrence of micro-cracks and surface defects. This led to a higher yield of usable wafers and improved the overall quality of the integrated circuits produced. The production process became more efficient, with a 20% increase in throughput.

Case 2: Photovoltaic Industry

Challenge: The client needed to increase the efficiency of cutting monocrystalline silicon wafers while reducing material waste.
Solution: Implementing high-precision diamond cutting wire with a diameter of 0.2 mm.
Outcome: The diamond cutting wire enabled the manufacturer to achieve thinner and more precise cuts, significantly reducing kerf loss. This resulted in a 15% increase in wafer yield and a 10% reduction in overall production costs. The smoother surface of the wafers also minimized the need for extensive post-cutting processing.

 

Case 3: LED Manufacturing

Challenge: The client needed to enhance the precision of cutting sapphire substrates for LED chip production.
Solution: Adoption of our diamond cutting wire specially made for sapphire.
Outcome: The diamond wire provided excellent cutting smoothness and precision, resulting in high-quality sapphire substrates. This improvement in substrate quality translated to better-performing LED chips with higher luminous efficiency and longer lifespan. The production line saw a 25% decrease in defect rates.

 

After Sales Service

 

  
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